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3 edition of 10th IEEE Workshop on Signal Propagation on Interconnects found in the catalog.

10th IEEE Workshop on Signal Propagation on Interconnects

IEEE Workshop on Signal Propagation on Interconnects (10th 2006 Berlin, Germany)

10th IEEE Workshop on Signal Propagation on Interconnects

May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings

by IEEE Workshop on Signal Propagation on Interconnects (10th 2006 Berlin, Germany)

  • 82 Want to read
  • 1 Currently reading

Published by IEEE in Piscataway, N.J .
Written in English

    Subjects:
  • Printed circuits -- Congresses,
  • Interconnects (Integrated circuit technology) -- Congresses,
  • Signal theory (Telecommunication) -- Congresses

  • Edition Notes

    Other titlesIEEE Workshop on Signal Propagation on Interconnects, SPI 2006 proceedings
    Statementco-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC).
    GenreCongresses.
    ContributionsComponents, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation., IEEE Computer Society. Technical Council on Test Technology.
    Classifications
    LC ClassificationsTK7868.P7 I35 2006
    The Physical Object
    Pagination289 p. :
    Number of Pages289
    ID Numbers
    Open LibraryOL16329466M
    ISBN 101424404541
    LC Control Number2007272796

    Reliability Monitoring of a Separable Land Grid Array Using Time Domain Reflectometry, Michael H. Azarian, 17 th IEEE Workshop on Signal and Power Integrity (SPI), Paris, France, May , Use of Temperature as a Health Monitoring Tool for Solder Interconnect Degradation in Electronics, P. Chauhan, M. Osterman, M. Pecht, and Q. Yu. Eby G. Friedman is an electrical engineer, and Distinguished Professor of Electrical and Computer Engineering at the University of an is also a Visiting Professor at the Technion - Israel Institute of is a Senior Fulbright Fellow and a Fellow of the IEEEBorn: 10 August (age 62), Jersey City, . In IEEE 15th Workshop on Signal Propagation on Interconnects, SPI - Proceedings (pp. ). [] ( IEEE 15th Workshop on Signal Propagation on Interconnects, SPI - Proceedings).Cited by: 5.


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10th IEEE Workshop on Signal Propagation on Interconnects by IEEE Workshop on Signal Propagation on Interconnects (10th 2006 Berlin, Germany) Download PDF EPUB FB2

Genre/Form: Electronic book Conference papers and proceedings Congresses: Additional Physical Format: Print version: IEEE Workshop on Signal Propagation on Interconnects (10th: Berlin, Germany). Signal Propagation on Interconnects, IEEE Workshop on; Signal Propagation on Interconnects, SPI IEEE Workshop on; Signal Propagation on Interconnects, SPI 12th IEEE Workshop on; Signal Propagation on Interconnects, SPI ' IEEE Workshop on; Signal Propagation on Interconnects, 6th IEEE Workshop on.

Kinzelbach, H.: Statistical variations of interconnect parasitics: Extraction and circuit simulation. In: Proceedings of the 10th IEEE Workshop on Signal Propagation on Interconnects, pp.

33– Budapest, 09–12 May () Google ScholarCited by: 3. IEEE Workshop on Signal Propagation on Interconnects > c1 Abstract The following topics are dealt with: on-chip interconnects; transmission lines and high-speed channels; macromodeling by vector fitting; linear macromodeling; interconnect characterization; optical interconnects; 3D modeling; packaging and power integrity; interconnect modeling and.

Signal Propagation on Interconnects (SPI), IEEE 14th Workshop on Signal-Image Technology & Internet-Based Systems (SITIS), Fifth International Conference on Signals and Electronic Systems (ICSES), International Conference on. IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting.

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science. 11th IEEE workshop on signal propagation on interconnects Details; Contributors; Bibliography; Quotations; Similar; Collections; Source.

IEEE Workshop on Signal Propagation on Interconnects > i - xi. Identifiers. book ISBN: book e-ISBN: DOI /SPI 13th IEEE Workshop on signal propagation on interconnects Details; Contributors; Bibliography; Quotations; Similar; Collections; Source. IEEE Workshop on Signal Propagation on Interconnects > 1 - 8.

Abstract. The following topic are dealt with: electronic packaging; integrated circuit interconnection; linear macromodelling; and power. IEEE 16th International Workshop on Advanced Motion Control (AMC) AMC is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.

IEEE Conferences Committee formulates and recommends actions, strategies, and policies for IEEE conferences. It provides oversight for conference-related activities, has jurisdiction over all 1,+ IEEE global conferences, and ensures compliance per all IEEE Policies - Section 10 (PDF, 1 MB).

The committee is administratively a standing committee of TAB with members from IEEE. Conferences related to Space Charges Back to Top. IEEE 16th International Workshop on Advanced Motion Control (AMC) AMC is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.

Proceedings 6th IEEE Workshop on Signal Propagation on Interconnects Details; Contributors; Bibliography; Quotations; Similar; Collections; Source. Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects. Identifiers. book ISBN: DOI /SPI L. Cohen "Time-frequency distributions ̵ A review" Proc.

IEEE vol. 77 pp. Jul. Cohen "Pulse propagation in dispersive media" Proc. 10th IEEE Workshop Statistical Signal and Array Processing pp. Signal Propagation on Interconnects This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field.

This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects.

Academics and industry expect view that the replacement of Cu metal for the finest metal tracks might occur in the next scaling nodes. This keynote speech will focus on the impact of interconnects on circuits’ reliability, power-thermal-signal integrity.

He received the Best Paper Award from the 2nd IEEE/IET International Symposium on Communication Systems, Networks and Digital Signal Processing, July 18–20,Bournemouth, U.K., the Best Paper Prize from the 3rd IEEE International Workshop on Antenna Technology, March 21–23,Cambridge, U.K., and the Best Paper Award from the 10th.

Power Apparatus and Systems, Part III. Transactions of the American Institute of Electrical Engineers. 12th Learning and Technology Conference, Electrical Overstress/Electrostatic Discharge Symposium, 29th Electrical Overstress/Electrostatic Discharge Symposium, 3-D Digital Imaging and Modeling,   10th Central PA Symposium On Signal Integrity The Center for Signal Integrity at Penn State Harrisburg will host the 10th Central Pennsylvania Symposium on Signal Integrity, Ap from 8 a.m.

to p.m. in the Capital Union Building on campus. How is Signal Propagation of Interconnects (IEEE workshop) abbreviated. SPI stands for Signal Propagation of Interconnects (IEEE workshop). SPI is defined as Signal Propagation of Interconnects (IEEE workshop) rarely.

interconnects using physics-based models and microwave network parameters,” in Proc. 12th IEEE Workshop Signal Propagation on Interconnects, Avignon, France, May 4- Fuad M.

Khoshnaw, Evaluation the Moisture Effects on the Performance of Electronic Devices, 14 th IEEE Workshop on Signal Propagation on Interconnects, MayHildesheim, Germany, pp. BibTeX @INPROCEEDINGS{Telescu06calvez“low, author = {M. Telescu and N. Tanguy and P.

Brehonnet and P. Vilbe and L. Calvez}, title = {Calvez “Low Complexity Equivalent Circuit Models for VLSI Interconnects}, booktitle = {In proceedings of 10th IEEE workshop on Signal Propagation on Interconnects (SPI}, year = {}, pages = {}}.

This study describes a concept of a novel microstrip directional coupler for differential signal decoupling, which can be used to digital signal overhearing on printed-circuit-boards. The complete design method is proposed with rules given analytically.

Considered methodology is suitable for synthesis of couplers with low coupling factors, which have negligible influence on Cited by: 3. ISBN: OCLC Number: Notes: "Originally published by Kluwer Law International, Boston in " First IEEE Workshop on Signal Propagation on Interconnects (SPI), held at Travemünde, Germany, MayMicrowave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), IEEE 5th International Symposium on Molded Interconnect Devices (MID), 12th International Congress; Molded Interconnect Devices (MID), 13th International Congress IEEE 10th Workshop on; Multimedia Signal Processing, MMSP.

This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of Signal propagation on interconnects.

Get this from a library. Proceedings, 11th IEEE Workshop on Signal Propagation on Interconnects: May, Hotel Portofino Kulm, Camogli (Genova), Italy.

[Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society.

Technical Council on Test Technology.;]. Passive rational function fitting of a driving-point impedance from its real part. In Proceedings - 10th IEEE Workshop on Signal Propagation on Interconnects, SPI (pp. [] (Proceedings - 10th IEEE Workshop on Signal Propagation on Interconnects, SPI ).

Institute of Electrical and Electronics Engineers by: 4. Extension of a full-wave layered interconnect simulator (UA-FWLIS) to handle lossy interconnects. In Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI (Vol.pp.

Extension of a full-wave layered interconnect simulator (UA-FWLIS) to handle lossy : Yi Cao, Zhaohui Zhu, Xing Wang, S.L.

Dvorak, J.L. Prince. Get this from a library. IEEE 15th Workshop on Signal Propagation on Interconnects. IEEE 7th Workshop on Signal Propagation on Interconnects (SPI ) Venue: Hotel Garden Siena. Location: Siena, Italy. Location: Siena, Italy. 15th IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS May- Conference Centre Federico II, Naples, Italy Download the pdf version here.

Fast simulation of interconnect structures using adaptive integral method (AIM). / Okhmatovski, Vladimir I.; Cangellaris, Andreas C. Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI.

(Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI).Author: Vladimir I. Okhmatovski, Andreas C.

Cangellaris. Banerjee K, Souri S, Kapur P, Saraswat K. 3-D Heterogeneous ICs: A technology for the next decade and beyond. 5th IEEE Workshop on Signal Propagation on Interconnects, Venice, Italy, May Banerjee K, Souri S, Kapur P, Saraswat K. 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip.

Click on the book chapter title to read : Juan A. Martinez-Velasco. ra, as, "Generating Reduced Order Models for High Speed VLSI Interconnects using Balancing-Free Square Root Method" in proceedings of 12th IEEE Workshop on Signal Propagation on Interconnects (SPI ).

MayAvignon, Popes Palace, France. (IEEE Computer Press). [email protected] Publicity Eric Palmer [email protected] PACE Mike Andrews, [email protected] • Membership Russ Kinner, @ Student Activities Jim Drye, [email protected] Conferences Henning Braunisch, [email protected] Awards Vasudeva P.

Atluri, Chen, E. Gad, W. Tseng, M. Nakhla and R. Achar, "A Passive Model-Order Reduction Algorithm for RLC Networks with Embedded Delay Elements", Proc. 10th IEEE Workshop on Signal Propagation on Interconnects, MayBerlin, Germany.

Sudo, T., & Bonkohara, M. Simulation of reduction properties of radiated emission by on-chip decoupling Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI (pp. ).[] (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI).Cited by: 2. A plaque presented at the IEEE 10th Workshop on Signal Propagation on Interconnects in Berlin, Germany, states: “Remembering John L.

Prince Provocative yet Calm, Curious yet Courteous, Visionary yet Pragmatist, Challenging yet Friendly This was the legacy of John!. S. R. Banerjee and R. F. Drayton, “A 3D miniaturization method for low impedance designs,” Proceedings of the 9th IEEE Workshop on Signal Propagation on Interconnects, pp.May Stable model order reduction method using Kautz functions: Application to VLSI circuits.

Workshop on Signal Propagation On Interconnects, Models for VLSI Interconnects, 10th IEEE Workshop on.Deng, Z & Schutt-Aine, JLIM-SPICE for the analysis of power distribution networks. in Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI, Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPIvol.pp.9th IEEE Workshop on Signal Propagation on Interconnects Cited by: 7.